High-speed signal, high-density substrate "Back Drill Substrate"
Providing high-speed transmission boards with better characteristics! Applications include base stations, communication devices, and high-speed routers.
We would like to introduce our high-speed signal and high-density substrate, the "Back Drill Substrate." By removing unnecessary through-hole stubs through back drilling, we eliminate signal disturbances. Furthermore, it becomes possible to reduce attenuation, allowing us to provide high-speed transmission substrates with better characteristics. 【Features】 ■ Back drilling ■ Capability to eliminate signal disturbances and reduce attenuation *For more details, please refer to the PDF document or feel free to contact us.
- 企業：三和電子サーキット
- 価格：Other
